25th March 2026
Microchip Technology has unveiled a new automotive-grade System-in-Package (SiP) microcontroller designed to improve the performance and efficiency of in-vehicle displays and human-machine interface (HMI) systems. The newly introduced SAM9X75D5M hybrid MCU integrates both a microprocessor and memory into a single compact package, helping automakers simplify design complexity while delivering richer graphics and smoother user experiences. This solution is aimed at a wide range of applications, including digital instrument clusters, infotainment systems, HVAC controls, and even EV charging interfaces.
One of the key highlights of the new chip is its built-in 512 Mbit DDR2 memory, which eliminates the need for separate external memory components. This not only reduces circuit board complexity but also helps manufacturers avoid supply chain challenges linked to sourcing discrete memory. The chip supports displays up to 10 inches with XGA resolution, enabling clear and responsive visuals for modern vehicle dashboards. It also offers multiple connectivity options such as CAN FD, USB, Gigabit Ethernet, and Time-Sensitive Networking (TSN), making it suitable for increasingly connected and software-driven vehicles.
Microchip’s hybrid MCU architecture bridges the gap between traditional microcontrollers and more powerful microprocessors, allowing developers to scale performance without significantly increasing cost or power consumption. This is particularly important as vehicles adopt more advanced digital interfaces and features that demand higher computing capability. By combining processing power, memory, and connectivity into a single unit, the new SiP solution is expected to accelerate development timelines and improve system reliability.
Overall, the launch reflects the growing demand for smarter, display-centric vehicle interiors. As automakers continue to enhance user experience through digital cockpits and connected features, integrated semiconductor solutions like this will play a critical role in enabling next-generation automotive technologies.
