Press Release, 4 February 2026
Heilind Electronics has added the Molex High-Speed FAKRA-Mini (HFM®) Interconnect System to its range of automotive connectivity solutions, addressing the growing demand for compact, high-performance data links in modern vehicles. These advanced interconnects are engineered to support the next generation of automotive electronics including ADAS (Advanced Driver-Assistance Systems), autonomous driving sensors, telematics, high-resolution displays and other data-intensive applications — by delivering speeds up to 28 Gbps and frequencies as high as 20 GHz while occupying significantly less space than traditional FAKRA connectors.
As modern vehicles pack in more cameras, radar, lidar and infotainment modules, design engineers face the twin challenges of preserving space and ensuring reliable high-speed communication across multiple systems. The Molex HFM interconnect addresses these issues with a miniaturized footprint — up to 80 % smaller than standard FAKRA designs — without compromising signal integrity or environmental robustness. Robust features such as integrated secondary locks (ISL), optional connector position assurance (CPA), and durable shielding protect against vibration, temperature extremes and electromagnetic interference, making the system suitable for demanding automotive environments.
The platform supports a broad range of automotive-grade protocols like Ethernet, MIPI A-PHY, GMSL2/3, FPD-Link III/IV and HDBase-T, giving automakers flexibility in designing future-ready vehicle architectures. Connector options include single, dual, dual-stack and quad configurations, enabling scalable use from simple wire-to-wire links to complex module-to-module connections. By integrating this high-speed technology, Heilind strengthens its ability to support engineers in achieving space-efficient, high-performance designs that meet the rigors of advanced vehicle systems.
This strategic addition to Heilind’s portfolio underscores the industry’s shift toward more connected, data-driven vehicle platforms where speed, reliability and miniaturization are key to unlocking next-generation automotive capabilities.
Compiled using AI
