Infineon, Honda forge automotive semiconductor partnership
Munich, Germany and Tokyo, Japan – February 2024 – Infineon Technologies, a supplier of semiconductor solutions and Honda Motor Co., Ltd. announced a partnership focusing on collaborating on automotive semiconductor solutions. The MoU establishes a framework for aligning future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies. Infineon will provide advanced semiconductor technologies to improve the performance, safety, and connectivity of Honda’s vehicles.
“Infineon’s system understanding and broad product portfolio have made us an appreciated partner to Japan’s automotive industry. Our outstanding quality further solidifies this partnership,” said Peter Schiefer, President of the Automotive Division at Infineon. “We are honored to be the semiconductor partner for a strategic collaboration with Honda. Intensifying a long-standing partnership even further is always a confirmation of the added value created. At the same time, it’s an expression of the trust in contributing to future successes.”
It will support Honda with technologies to enable competitive and advanced vehicles. The technical support will focus on the area of power semiconductors and Advanced Driver Assistance Systems (ADAS). Both parties will collaborate on new architecture concepts in E/E architectures.
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