ROHM strengthens India play with semiconductor packaging partnership for automotive sector

20th March 2026

Japanese semiconductor company ROHM is accelerating its India strategy through a new partnership focused on power semiconductor packaging an essential technology for electric vehicles (EVs) and modern automotive systems. The collaboration, formed with India-based Suchi Semicon, aims to build local back-end manufacturing capabilities, including chip assembly and packaging, which are critical steps in making semiconductors ready for real-world automotive applications. This move highlights India’s growing importance in the global semiconductor value chain, especially as automakers increasingly depend on reliable power devices for electrification and advanced electronics.

The partnership will combine ROHM’s expertise in power semiconductor design with Suchi Semicon’s manufacturing capabilities to create a scalable and localized production framework. A key focus is outsourcing back-end processes such as packaging and testing for power devices and integrated circuits, with technical evaluations already underway and mass production targeted from 2026. This is particularly significant for the automotive sector, where high-performance and durable semiconductor packaging is crucial for applications like EV powertrains, onboard electronics, and energy management systems. By enabling local production, the collaboration is expected to improve supply chain resilience, reduce dependency on imports, and shorten delivery timelines for automotive manufacturers.

Beyond manufacturing, both companies plan to expand their collaboration by developing advanced packaging technologies and increasing the range of locally produced semiconductor solutions. The initiative aligns closely with India’s “Make in India” vision and reflects a broader industry shift toward regionalizing semiconductor supply chains to mitigate global disruptions. As demand for EVs and connected vehicles continues to rise, this partnership positions India as an emerging hub for semiconductor packaging, offering both domestic and global automotive players a more reliable and efficient sourcing option. Ultimately, ROHM’s move underscores how strategic collaborations are reshaping the future of automotive electronics by bringing production closer to key growth markets like India.

The partnership between ROHM and Suchi Semicon is driven by a mix of strategic, technological, and market-based reasons:

1. Growing EV and automotive demand
India’s automotive sector especially electric vehicles is expanding rapidly. Power semiconductors are critical for EVs (battery management, inverters, charging), so ROHM wants to be closer to this fast-growing market.

2. Supply chain diversification
Global chip shortages and geopolitical risks exposed weaknesses in relying heavily on a few regions. By partnering in India, ROHM reduces dependency on traditional hubs like China and Southeast Asia.

3. Cost and efficiency advantages
India offers lower manufacturing and labor costs, making semiconductor packaging more economical while maintaining scalability.

4. Government push (Make in India)
India is actively supporting semiconductor manufacturing through incentives. This makes it attractive for companies like ROHM to invest and localize production.

5. Strengthening local ecosystem
Suchi Semicon brings local manufacturing capability, helping ROHM quickly establish backend operations (assembly, packaging, testing) without building everything from scratch.

6. Faster time-to-market
Local packaging means shorter delivery timelines for Indian and global automotive clients, improving responsiveness and competitiveness.