Siemens and SAICEC team up to speed up vehicle-chip development with digital twins

In a new collaboration announced on 17 November 2025, global engineering firm Siemens and Chinese automotive-chip specialist SAICEC are joining forces to fast-track vehicle development by using Siemens’ digital twin software platform, PAVE360. SAICEC will build complex digital models of automotive-system architectures — ranging from entire vehicles down to the chip level — leveraging PAVE360 to enable early validation of systems such as ADAS (Advanced Driver Assistance Systems) and IVI (In-Vehicle Infotainment).

By creating these “system-to-chip” digital twins, the partnership aims to help OEMs identify next-generation chip technologies and overcome the traditional challenge of siloed development workflows, where hardware and software teams work separately until late in the process. Siemens says this will reduce costly redesigns, shorten development cycles and boost the functional safety of software-defined vehicles. SAICEC’s CEO, David He, emphasised that the collaboration gives China’s automotive IC ecosystem access to world-class simulation tools, while Siemens’ CEO of Digital Industries Software, Mike Ellow, highlighted how PAVE360 can serve OEMs and suppliers with a multi-fidelity, scalable validation environment.

Together, this initiative reflects the growing importance of digital twins in the mobility sector, allowing manufacturers to validate architectures early — before physical prototypes are built — and thus accelerate innovation in the age of software-defined vehicles