TE Connectivity unveils new “Inside Device Connectivity” line for automotive ECUs
TE Connectivity has launched a fresh suite of connector products under its Inside Device Connectivity portfolio, aimed squarely at the demands of next-generation vehicles and evolving E/E (electrical/electronic) architectures. This collection spans board-to-board, wire-to-board, flex-to-board, and wire-to-wire connectors, crafted to support critical modules like battery systems, ECUs, power converters, high-performance computing, and ADAS units in modern vehicles.
What sets this lineup apart is its design for compactness, robustness, and high electrical performance—features that align with software-defined vehicle (SDV) and zonal architecture trends. TE’s solutions promise to withstand harsh automotive conditions: they tolerate vibration, misalignment, electromagnetic interference (EMI), temperature swings, humidity, and contamination. On the specs front, the connectors offer current handling up to 45 A (for wire-to-board) and up to 18 A (board-to-board), with pin pitches ranging from 0.4 mm up to 10.16 mm and support up to 180 pins.
TE says these connectors enable OEMs and Tier-1 suppliers to reduce module size, simplify integration, and more easily scale for software-defined vehicle platforms. Backed by TE’s global manufacturing footprint and engineering support, the Inside Device Connectivity portfolio aims to accelerate adoption in future vehicle architectures. The new products will also be showcased at the upcoming Battery Show North America in Detroit (October 6–9).
Source: te.com
