Press Release, 26 September 2025
Synopsys has announced a strengthened collaboration with TSMC, bringing new certified tools and AI-powered flows to enable efficient chip design across both 2D and 3D architectures. As part of the deal, several Synopsys-owned Ansys simulation and analysis platforms including RedHawk-SC, Totem, and HFSS-IC Pro — have been certified for TSMC’s advanced process nodes, such as N3C, N3P, N2P, N5, and even the upcoming A-series (A14, A16). These tools help engineers validate power, signal integrity, thermal behavior, and electromagnetic effects in high-performance chips.
On the photonics side, the partnership includes an AI-assisted design flow for TSMC’s COUPE™ photonics platform. By combining AI-based optimization (using tools like optiSLang and Zemax OpticStudio) with simulation through Lumerical FDTD, designers can cut down on iteration cycles and improve component integration efficiency. Meanwhile, Synopsys is enhancing its multiphysics analysis flows to support hierarchical 3D-IC design, enabling better thermal and timing analysis for stacked die or multi-die systems. Altogether, this work aims to make it easier for semiconductor companies to build chips for AI, high-speed communication, automotive, and advanced computing applications.
Source: PR Newswire
