News, 13 August 2025
On 12 August 2025, the Union Cabinet, led by Prime Minister Modi, approve four major semiconductor manufacturing projects across Odisha, Punjab, and Andhra Pradesh under the India Semiconductor Mission (ISM). This ₹4,600 crore investment paves the way for India’s first commercial compound semiconductor fab and advanced packaging units—heralding a new era of automotive-grade chip production.
These semiconductor manufacturing projects will be on-
SiCSem in Odisha: India’s first fab dedicated to Silicon Carbide (SiC) components—critical for EVs, fast chargers, rail systems, solar inverters, and defense electronics. Production capacity: 60,000 wafers/year; packaging: 96 million units.
3D Glass Solutions (Odisha): Launching an advanced packaging unit featuring glass interposers, silicon bridges, and 3D heterogeneous integration (3DHI) modules—vital for high-performance computing (HPC), AI, and automotive ADAS systems. Capacity: ~70k glass substrates, 50M assembled units, 13.2k 3DHI modules/year.
ASIP (Andhra Pradesh): In partnership with South Korea’s APACT Co. Ltd., this facility will produce chips for automotive electronics, mobile devices, and set-top boxes at ~96 million units per year.
CDIL (Punjab): Expanding to manufacture high-power discrete semiconductors—MOSFETs, IGBTs, Schottky diodes, transistors in both Silicon and SiC—key components in EV powertrains, charging infrastructure, renewable energy systems, and industrial electronics. Capacity: ~158 million units/year.
These projects would lead to- (1) Strengthening Atmanirbhar Bharat in Auto-Tech: Domestic SiC fabs and advanced packaging capabilities are game-changers for India’s EV and automotive electronics value chain. (2) Boost to Skilled Jobs & Innovation: These facilities will create ~2,034 skilled jobs and many more indirect roles, while supporting 278 academic institutions and 72 semiconductor startups. (3) Robust Chip Ecosystem: From fab to package, India ramps up toward end-to-end semiconductor autonomy—critical for national security, smart mobility, and future digital infrastructure. (4) Global Confidence Builder: The approval signals India’s emergence as a credible, certified maker of automotive-grade chips and packaging tech—attracting further investment and partnerships.
Source: Press Information Bureau
