Barcelona, Spain – Feb 26, 2024 – HARMAN, a subsidiary of Samsung Electronics, announced the launch of the HARMAN Ready Connect 5G Telematics Control Unit (TCU), leveraging state-of-the-art Snapdragon® Digital Chassis™ connected car technologies from Qualcomm Technologies, Inc. to push connectivity boundaries and democratize the automotive connectivity landscape. The Ready Connect TCU is a smart device designed to provide faster data transfer speeds and improved connectivity for vehicles, allowing drivers to access a range of features including GPS navigation, music streaming, and voice commands. HARMAN Ready Connect 5G TCU is currently available and will showcase this week at Mobile World Congress (MWC) 2024.
About HARMAN Ready Connect 5G TCU: ( ~ Gemini Google)
The Ready Connect 5G TCU (Telematics Control Unit) is a cutting-edge piece of hardware designed to supercharge in-car connectivity. It leverages Qualcomm’s Snapdragon Auto 5G Modem-RF Gen 2 technology, allowing for super-fast and reliable 5G connections in vehicles.
The companies remain committed to delivering solutions that not only meet the demands of today’s consumers. They also pave the way for the next generation of connected vehicles. With the Snapdragon® Modem-RF Gen 2 system, Ready Connect 5G TCU offers unparalleled connectivity performance. Moreover, it maximizes upgradability, scalability, and usability to meet the evolving requirements of today’s automotive market.
“HARMAN and Qualcomm Technologies are working together. They aim to redefine the future of automotive connectivity,” said Pascal Peguret, SVP, Connectivity for HARMAN Automotive. “The Ready Connect 5G TCU product is a testament to that shared vision, disrupting the traditional TCU approach as an off-the-shelf TCU product. Moreover, HARMAN designed the Ready Connect 5G TCU to meet the needs of automakers simply and effectively. It expedites the time to market and significantly reduces development costs.”
“As pioneers in wireless technologies, Qualcomm Technologies is pleased to further strengthen our longstanding relationship with HARMAN. This collaboration aims to help bring the Ready Connect 5G TCU to the industry. This product also exemplifies our dedication to driving connectivity innovation in the automotive industry. Moreover, it delivers a seamless combination of performance, reliability, and cutting-edge features through the utilization of our Snapdragon Modem-RF Gen 2 system,” said Jeff Arnold, Vice President, Product Management, Qualcomm Technologies, Inc.
HARMAN invites the automotive industry to explore the benefits of this technology collaboration. Experience firsthand how the HARMAN Ready Connect 5G TCU is shaping the future of in-cabin connectivity.
Visit the HARMAN showcase at MWC in Hall 4, Booth# 4B45 to see a demonstration of the Ready Connect 5G TCU product throughout the week.
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