BorgWarner integrates STMicro tech in Volvo’s next-gen EVs
Auburn Hills, Michigan and Geneva, Switzerland / India – Sept.4, 2023 – STMicroelectronics will supply BorgWarner the third generation 750V silicon carbide (SiC) power MOSFETs dice for their Viper-based power module. BorgWarner’s traction inverter platform is using this power module for Volvo electric vehicles.
“This collaboration will give Volvo Cars the opportunity to further increase the attractiveness of our electrical vehicles with longer range and faster charging. It will also support us on our journey towards being fully electric by 2030. It will strengthen our increased vertical integration and our control of critical components,” says Javier Varela, Chief Operating Officer & Deputy CEO, Volvo Cars.
“BorgWarner is pleased to partner with ST to supply our longstanding customer Volvo Cars with inverters for their next generation of BEV platforms,” says Stefan Demmerle, Vice President of BorgWarner Inc. and President and General Manager, PowerDrive Systems.
To fully leverage the performance of ST’s SiC MOSFET dice, BorgWarner collaborated closely with ST’s technical team. Furthermore, they worked together to match their die with BorgWarner’s Viper power switch. This also aimed to maximize inverter performance and deliver a compact and cost-effective architecture. The companie’s collaboration provides the high-volume capability required by the quickly growing EV market.
“Our collaboration with BorgWarner will enable Volvo Cars to offer their customers superior vehicle performance and range,” says Marco Monti, President, Automotive and Discrete Group, STMicroelectronics. “We are committed to expanding SiC capacity. We also committed to reinforcing our SiC supply, including through vertical integration. Moreover, this is as we ramp up volumes to support our global automotive and industrial customers in their shift to electrification and higher efficiency.”
ST’s high-volume STPOWER SiC products are manufactured in its fabs in Italy and Singapore. Advanced packaging and testing occur at its back-end facilities in Morocco and China. In October 2022, ST announced its plan to expand its wide bandgap manufacturing capacity. They intended to do so by establishing a new integrated SiC substrate manufacturing facility in Catania. Catania, situated at the heart of the company’s power semiconductor expertise. It plays a pivotal role in integrated SiC research, development, and manufacturing.